Optical Vibration Sensor Module Based on Beating Principle for Monitoring of Semiconductor Manufacturing Equipment
Crossref DOI link: https://doi.org/10.1007/s12541-024-01099-0
Published Online: 2024-08-08
Published Print: 2024-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Moon, Kee S.
Lee, Moon Gu https://orcid.org/0000-0002-1607-806X
Funding for this research was provided by:
Ajou University
Text and Data Mining valid from 2024-08-08
Version of Record valid from 2024-08-08
Article History
Received: 3 May 2024
Revised: 31 July 2024
Accepted: 31 July 2024
First Online: 8 August 2024