Microstructure and mechanical property of Sn–Ag–Cu solder material
Crossref DOI link: https://doi.org/10.1007/s12598-015-0579-1
Published Online: 2015-08-19
Published Print: 2017-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kong, Yi-Gang
Kong, Zhi-Gang http://orcid.org/0000-0001-6338-082X
Shi, Feng-Min
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