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Aging resistance and mechanical properties of Sn3.0Ag0.5Cu solder bump joints with different bump shapes

Published Online: 2015-09-18

Published Print: 2021-01

Authors

Chen, Ping

Zhao, Xiu‐Chen https://orcid.org/0000-0002-0297-4015
Liu, Ying

Li, Hong

Wang, Yong
Funding

Funding for this research was provided by:

National Science and Technology Major Project (No. 2011ZX02607)
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Version of Record valid from 2015-09-18

Text and Data Mining valid from 2015-09-18

Text and Data Mining valid from 2015-09-18

Version of Record valid from 2015-09-18
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Article History

Received: 4 September 2014

Revised: 22 April 2015

Accepted: 28 August 2015

First Online: 18 September 2015

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