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Advanced hermetic electronic packaging based on lightweight silicon/aluminum composite produced by powder metallurgy technique

Crossref DOI link: https://doi.org/10.1007/s12598-016-0833-1

Published Online: 2016-12-20

Published Print: 2020-11

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Liu, Yan‐Qiang https://orcid.org/0000-0001-7325-3525
Fan, Jian‐Zhong

Hao, Xin‐Xiang

Wei, Shao‐Hua

Nie, Jun‐Hui

Ma, Zi‐Li

Liu, Ming‐Kun

Wang, Ya‐Bao
Funding

Funding for this research was provided by:

National Basic Research Program of China (No. 2012CB619600)

National Key Research and Development Program of China (2012CB619600)
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Version of Record valid from 2016-12-20

Text and Data Mining valid from 2016-12-20

Text and Data Mining valid from 2016-12-20

Version of Record valid from 2016-12-20
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Article History

Received: 17 October 2015

Revised: 24 December 2015

Accepted: 11 November 2016

First Online: 20 December 2016