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Morphologies and evolution of intermetallic compounds formed between Sn1.0Ag0.7Cu composite solder and Cu substrate

Crossref DOI link: https://doi.org/10.1007/s12598-017-0968-8

Published Online: 2017-11-09

Published Print: 2023-03

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Sui, Yan‐Wei

Sun, Ren

Qi, Ji‐Qiu

He, Ye‐Zeng

Wei, Fu‐Xiang

Meng, Qing‐Kun

Sun, Zhi
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (No. 51671214)

National Natural Science Foundation of China (No. 51601220)

National Natural Science Foundation of China (No. 51671214)

National Natural Science Foundation of China (No. 51601220)

Science and Technology project of Jiangsu Province (BY2016026-05)
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Text and Data Mining valid from 2017-11-09

Text and Data Mining valid from 2017-11-09

Version of Record valid from 2017-11-09
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Article History

Received: 6 October 2016

Revised: 21 November 2016

Accepted: 20 September 2017

First Online: 9 November 2017