Crossmark

Microstructures and thermal properties of Sn–Bi–Pb–Zn alloys as heat storage and transfer materials

Crossref DOI link: https://doi.org/10.1007/s12598-019-01206-5

Published Online: 2019-02-22

Published Print: 2019-04-10

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Wang, Qing‐Meng

Cheng, Xiao‐Min https://orcid.org/0000-0002-5057-9001
Li, Yuan‐Yuan

Yu, Guo‐Ming

Liu, Zhi
Funding

Funding for this research was provided by:

Fundamental Research Funds for the Central Universities (2017II23GX)

National Key Technology Research & Development Program of China (2012BAA05B05)

Key Technology Research & Development Program of Hubei (2015BAA111)

Fundamental Research Funds for the Central Universities (2017II23GX)
License Information

Version of Record valid from 2019-02-22

Text and Data Mining valid from 2019-02-22

Text and Data Mining valid from 2019-02-22
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Article History

Received: 8 January 2018

Revised: 12 March 2018

Accepted: 7 January 2019

First Online: 22 February 2019