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Properties of (Fe–B)‐doped Sn–1.0Ag–0.5Cu solders prepared by mechanical alloying

Crossref DOI link: https://doi.org/10.1007/s12598-019-01248-9

Published Online: 2019-04-08

Published Print: 2019-07-10

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Wang, Ruo‐Da

Hu, Qiang https://orcid.org/0000-0002-3460-9581
Zhang, Shao‐Ming

Zhang, Fu‐Wen

Lu, Cai‐Tao

Wang, Zhi‐Gang
Funding

Funding for this research was provided by:

National Key R&D Program of China (2017YFB0305703)

National Key Research and Development Program of China (2017YFB0305703)
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Text and Data Mining valid from 2019-04-08

Text and Data Mining valid from 2019-04-08
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Article History

Received: 25 September 2018

Revised: 26 November 2018

Accepted: 14 March 2019

First Online: 8 April 2019