Crossmark

Promising high-thermal-conductivity substrate material for high-power electronic device: silicon nitride ceramics

Published Online: 2020-02-19

Published Print: 2020-05

Authors

Hu, Feng

Xie, Zhi-Peng https://orcid.org/0000-0003-0817-1843
Zhang, Jian

Hu, Zun-Lan

An, Di
Funding

Funding for this research was provided by:

National Key Research and Development Program of China (2017YFB0310400)

National Natural Science Foundation of China (51427802)
License Information

Text and Data Mining valid from 2020-02-19

Version of Record valid from 2020-02-19
More Information

Article History

Received: 9 April 2019

Revised: 20 July 2019

Accepted: 18 January 2020

First Online: 19 February 2020

Document is current