Crossmark

Low‐thermal‐conductivity thermal barrier coatings with a multi‐scale pore design and sintering resistance following thermal exposure

Crossref DOI link: https://doi.org/10.1007/s12598-020-01393-6

Published Online: 2020-04-02

Published Print: 2020-04

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Zhang, Wei‐Wei

Wei, Zhi‐Yuan

Zhang, Li‐Yuan

Xing, Ya‐Zhe https://orcid.org/0000-0003-4531-2035
Zhang, Qiang
Funding

Funding for this research was provided by:

The Fundamental Research Funds for the Central Universities, CHD (300102500102)

Province Natural Science Foundation of Shaanxi (2019JQ-380)
License Information

Version of Record valid from 2020-04-02

Text and Data Mining valid from 2020-04-01

Text and Data Mining valid from 2020-04-01

Version of Record valid from 2020-04-01
More Information

Article History

Received: 22 October 2019

Revised: 14 January 2020

Accepted: 5 March 2020

First Online: 2 April 2020