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Dynamic recrystallization behavior and microstructure evolution of high-performance Cu–3.28Ni–0.6Si–0.22Zn–0.11Cr–0.04P during hot compression

Published Online: 2020-09-15

Published Print: 2021-01

Authors

Wang, Chang-Sheng

Fu, Hua-Dong

Xie, Jian-Xin https://orcid.org/0000-0001-8429-471X
Funding

Funding for this research was provided by:

National Key Research and Development Program of China (2016YFB0301300)

National Science Foundation of China (51974028, U1602271)
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Text and Data Mining valid from 2020-09-15

Version of Record valid from 2020-09-15
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Article History

Received: 4 December 2019

Revised: 2 March 2020

Accepted: 22 August 2020

First Online: 15 September 2020

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