Crossmark

Dynamic recrystallization behavior and microstructure evolution of high‐performance Cu–3.28Ni–0.6Si–0.22Zn–0.11Cr–0.04P during hot compression

Crossref DOI link: https://doi.org/10.1007/s12598-020-01578-z

Published Online: 2020-09-15

Published Print: 2021-01

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Wang, Chang‐Sheng

Fu, Hua‐Dong

Xie, Jian‐Xin https://orcid.org/0000-0001-8429-471X
Funding

Funding for this research was provided by:

National Key Research and Development Program of China (2016YFB0301300)

National Natural Science Foundation of China (51974028)

National Natural Science Foundation of China (U1602271)

National Key Research and Development Program of China (2016YFB0301300)

National Science Foundation of China (51974028)

National Science Foundation of China (U1602271)
License Information

Version of Record valid from 2020-09-15

Text and Data Mining valid from 2020-09-15

Text and Data Mining valid from 2020-09-15

Version of Record valid from 2020-09-15
More Information

Article History

Received: 4 December 2019

Revised: 2 March 2020

Accepted: 22 August 2020

First Online: 15 September 2020