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Harnessing S-scheme junctions for enhanced CO2 photoreduction: molecular bonding of copper(II) complexes onto K-doped polymeric carbon nitride via microwave heating

Crossref DOI link: https://doi.org/10.1007/s12598-024-03000-4

Published Online: 2024-09-20

Published Print: 2025-02

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Heng, Ming-Yu

Shao, Hong-Lei

Sun, Jie-Ting

Huang, Qian

Shen, Shu-Ling

Yang, Guang-Zhi

Xue, Yu-Hua

Xiao, Shu-Ning https://orcid.org/0000-0002-1312-9386
Funding

Funding for this research was provided by:

Shanghai Science and Technology Commission (20060502200)

Shanghai Science and Technology Innovation Program (21DZ1206300, YDZX20213100003002)

Innovation Program of Shanghai Municipal Education Commission (2019-01-07-00-E00015)

National Natural Science Foundation of China (22106105, 22201180)
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Text and Data Mining valid from 2024-09-20

Version of Record valid from 2024-09-20
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Article History

Received: 18 May 2024

Revised: 24 July 2024

Accepted: 24 July 2024

First Online: 20 September 2024

Declarations

:

: The authors declare that they have no conflict of interest.

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