Document is current

Any future updates will be listed below

High‐performance Cu–Cu interconnects attained through air sintering of oleylamine‐capped Cu nanoparticles for power electronics packaging

Crossref DOI link: https://doi.org/10.1007/s12598-024-03076-y

Published Online: 2025-02-04

Published Print: 2025-05

Update policy: https://doi.org/10.1007/springer_crossmark_policy

About CrossMark