A coupled model of TiN inclusion growth in GCr15SiMn during solidification in the electroslag remelting process
Crossref DOI link: https://doi.org/10.1007/s12613-015-1194-8
Published Online: 2015-12-03
Published Print: 2015-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yang, Liang
Cheng, Guo-guang
Li, Shi-jian
Zhao, Min
Feng, Gui-ping
Li, Tao
Text and Data Mining valid from 2015-12-01