Effect of ultrasonic power introduced by a mold copper plate on the solidification process
Crossref DOI link: https://doi.org/10.1007/s12613-017-1388-3
Published Online: 2017-02-18
Published Print: 2017-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Shi, Xiao-fang
Chang, Li-zhong
Wang, Jian-jun
License valid from 2017-02-01
