Microstructural evolution and thermal conductivity of diamond/Al composites during thermal cycling
Crossref DOI link: https://doi.org/10.1007/s12613-020-2114-0
Published Online: 2021-11-03
Published Print: 2021-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Ping-ping
Chen, Guo-qin
Li, Wen-jun
Li, Hui
Ju, Bo-yu
Hussain, Murid
Yang, Wen-shu
Wu, Gao-hui
Text and Data Mining valid from 2021-11-01
Version of Record valid from 2021-11-01
Article History
Received: 19 April 2020
Revised: 3 June 2020
Accepted: 3 June 2020
First Online: 3 November 2021