Design and Properties of New Lead-Free Solder Joints Using Sn-3.5Ag-Cu Solder
Crossref DOI link: https://doi.org/10.1007/s12633-017-9690-2
Published Online: 2018-04-11
Published Print: 2018-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Shalaby, Rizk Mostafa
Kamal, Mustafa
Ali, Esmail Abdo Mohammed
Gumaan, Mohammed S.
Text and Data Mining valid from 2018-04-11
Article History
Received: 30 December 2015
Accepted: 15 November 2017
First Online: 11 April 2018