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Deep Dry Etching of Silicon with Scallop Size Uniformly Larger than 300 nm

Crossref DOI link: https://doi.org/10.1007/s12633-018-9948-3

Published Online: 2018-07-09

Published Print: 2019-04

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Lin, Yuanwei https://orcid.org/0000-0002-5293-1777
Yuan, Renzhi

Zhang, Xinshuai

Chen, Zhenpeng

Zhang, Haimiao

Su, Ziduo

Guo, Shengjun

Wang, Xiaoxin

Wang, Chun
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Text and Data Mining valid from 2018-07-09
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Article History

Received: 30 May 2018

Accepted: 2 July 2018

First Online: 9 July 2018