Evaluation of the Topographical Surface Changes of Silicon Wafers after Annealing and Plasma Cleaning
Crossref DOI link: https://doi.org/10.1007/s12633-019-00351-x
Published Online: 2019-12-13
Published Print: 2020-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Stach, Sebastian
Ţălu, Ştefan
Dallaev, Rashid
Arman, Ali
Sobola, Dinara
Salerno, Marco
Text and Data Mining valid from 2019-12-13
Version of Record valid from 2019-12-13
Article History
Received: 29 August 2019
Accepted: 4 December 2019
First Online: 13 December 2019