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Fuzzy Logic Based Model to Predict Surface Roughness of Si(100) Wafer Using Preliminary Experimental Data Obtained From Single Pole Magnetic Abrasive Finishing Process

Crossref DOI link: https://doi.org/10.1007/s12633-024-02986-x

Published Online: 2024-04-19

Published Print: 2024-07

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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