Coupled mechanical-electrical behavior and microstructural mechanisms of Cu²⁺ contaminated red clay
Crossref DOI link: https://doi.org/10.1007/s12665-025-12593-7
Published Online: 2025-09-29
Published Print: 2025-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chen, Yicheng
Zhou, Xiaowen
Chen, Xuejun
Ai, Xiaotao
Cheng, Jun
Text and Data Mining valid from 2025-09-29
Version of Record valid from 2025-09-29
Article History
Received: 15 May 2025
Accepted: 15 September 2025
First Online: 29 September 2025
Declarations
:
: The authors declare no competing interests.