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Spreading Behaviour and Joint Reliability of Sn–0.3Ag–0.7Cu Lead-Free Solder Alloy on Nickel Coated Copper Substrate as a Function of Reflow Time

Crossref DOI link: https://doi.org/10.1007/s12666-015-0640-7

Published Online: 2015-09-11

Published Print: 2015-12

Update policy: https://doi.org/10.1007/springer_crossmark_policy