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Interfacial IMC Layer and Tensile Properties of Ni-Reinforced Cu/Sn–0.7Cu–0.05Ni/Cu Solder Joint: Effect of Aging Temperature

Crossref DOI link: https://doi.org/10.1007/s12666-017-1104-z

Published Online: 2017-04-07

Published Print: 2017-11

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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