Influence of Grain Boundary Complexion on Deformation Mechanism of High Temperature Bending Creep Process of Cu Bicrystal
Crossref DOI link: https://doi.org/10.1007/s12666-018-1312-1
Published Online: 2018-03-24
Published Print: 2018-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Reddy, K. Vijay
Pal, Snehanshu http://orcid.org/0000-0002-4731-7107
Text and Data Mining valid from 2018-03-24
Article History
Received: 29 November 2017
Accepted: 16 March 2018
First Online: 24 March 2018