Qiu, Yu
Luo, Yijie
Hu, Xiaowu
Li, Yulong
Jiang, Xiongxin
Funding for this research was provided by:
Nature Science Foundation of China (No. 51465039, No. 51665038, No. 51765040)
Nature Science Foundation of Jiangxi Province (20151BAB206041, 20161BAB206122)
Article History
Received: 12 October 2017
Accepted: 7 November 2018
First Online: 27 November 2018
Compliance with Ethical Standards
:
: We declare that we have no financial and personal relationships with other people or organizations that can inappropriately influence our work, and there is no professional or other personal interest of any nature or kind of any product, service and/or company that could be construed as influencing the position presented in, or the review of, the manuscript entitled, “Research on interfacial reaction and growth behavior of intermetallic compound of dip-soldered Sn/Ni system.”