Wettability, Interfacial Intermetallic Growth and Joint Shear Strength of Eutectic Sn–Cu Solder Reflowed on Bare and Nickel-Coated Copper Substrates
Crossref DOI link: https://doi.org/10.1007/s12666-019-01568-5
Published Online: 2019-01-29
Published Print: 2019-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Sona, Mrunali
Tikale, Sanjay
Prabhu, Narayan http://orcid.org/0000-0002-8359-2587
Text and Data Mining valid from 2019-01-29
Article History
Received: 18 August 2018
Accepted: 10 January 2019
First Online: 29 January 2019