The Effect of Thermal Ageing on Solder/Substrate Interfacial Microstructures During Reflow of Sn–37Pb and Sn–3Ag–0.5Cu
Crossref DOI link: https://doi.org/10.1007/s12666-019-01583-6
Published Online: 2019-01-30
Published Print: 2019-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Satyanarayan, http://orcid.org/0000-0001-9895-8433
Kumarswamy, M. C.
Prabhu, K. N.
Text and Data Mining valid from 2019-01-30
Article History
Received: 24 August 2018
Accepted: 13 January 2019
First Online: 30 January 2019
Compliance with Ethical Standards
:
: The author(s) declare that they have no conflict of interest.