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Investigation on Thermal Conductivity and Solidification Process of Molten Slags by Using Copper Finger Dip Test

Crossref DOI link: https://doi.org/10.1007/s12666-019-01780-3

Published Online: 2019-09-19

Published Print: 2019-12

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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