Application of Electrochemical Impedance Spectroscopy (EIS) to Study the Effect of Temperature and Ion Concentration During Electroplating of Copper from an Acidic Bath
Crossref DOI link: https://doi.org/10.1007/s12666-023-03182-y
Published Online: 2023-12-20
Published Print: 2024-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Parida, Sudeshna http://orcid.org/0000-0003-1125-5140
Das, Sanjeev
Mallik, Archana
Text and Data Mining valid from 2023-12-20
Version of Record valid from 2023-12-20
Article History
Received: 30 April 2023
Accepted: 9 November 2023
First Online: 20 December 2023
Declarations
:
: There is no conflict to declare.