Metal–metal bonding using silver/copper nanoparticles
Crossref DOI link: https://doi.org/10.1007/s13204-015-0489-4
Published Online: 2015-08-19
Published Print: 2016-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kobayashi, Y.
Maeda, T.
Yasuda, Y.
Morita, T.
Funding for this research was provided by:
Research fund by Hitachi Ltd.
License valid from 2015-08-19