Improvement of droplet speed and stability in electrowetting on dielectric devices by surface polishing
Crossref DOI link: https://doi.org/10.1007/s13206-017-1408-4
Published Online: 2017-08-25
Published Print: 2017-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Shirinkami, Hamidreza
Kim, Jiman
Lee, Choonghee
Kim, Hee Chan
Chun, Honggu
License valid from 2017-08-25