Preparation, curing, and properties of boron-containing bisphenol-S formaldehyde resin/o-cresol formaldehyde epoxy resin/nano-SiO2 composites
Crossref DOI link: https://doi.org/10.1007/s13233-016-4031-7
Published Online: 2016-03-22
Published Print: 2016-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wu, Weihong
Leng, Jingjing
Wang, Zheng
Qu, Hongqiang
Gao, Jungang
Text and Data Mining valid from 2016-03-01