High-Performance Printed Circuit Board Materials Based on Benzoxazine and Epoxy Blend System
Crossref DOI link: https://doi.org/10.1007/s13233-018-6046-7
Published Online: 2018-03-21
Published Print: 2018-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Seon Ho
Kim, Ki Seok
Shim, Ji Hye
Ahn, Cheol-Hee
Text and Data Mining valid from 2018-03-21
Article History
Received: 15 November 2017
Revised: 29 November 2017
Accepted: 30 November 2017
First Online: 21 March 2018