Enhancement of Thermal Conductivity of Poly(methylmethacrylate) Composites at Low Loading of Copper Nanowires
Crossref DOI link: https://doi.org/10.1007/s13233-019-7155-8
Published Online: 2019-06-20
Published Print: 2019-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Thieu, Nhat Anh Thi
Vu, Minh Canh
Lee, Eui Sung
Doan, Vu Chi
Kim, Sung-Ryong
Text and Data Mining valid from 2019-06-20
Version of Record valid from 2019-06-20
Article History
Received: 16 January 2019
Revised: 18 April 2019
Accepted: 20 April 2019
First Online: 20 June 2019