Leaflet Stresses During Full Device Simulation of Crimping to 6 mm in Transcatheter Aortic Valve Implantation, TAVI
Crossref DOI link: https://doi.org/10.1007/s13239-022-00614-6
Published Online: 2022-03-01
Published Print: 2022-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Bressloff, N. W. http://orcid.org/0000-0002-4488-9687
Text and Data Mining valid from 2022-03-01
Version of Record valid from 2022-03-01
Article History
Received: 3 November 2021
Accepted: 2 February 2022
First Online: 1 March 2022
Conflict of interest
: The author declares that he has no conflicts of interest.