All-SiC Fiber-Optic Sensor Based on Direct Wafer Bonding for High Temperature Pressure Sensing
Crossref DOI link: https://doi.org/10.1007/s13320-021-0640-7
Published Online: 2021-10-02
Published Print: 2022-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Liang, Ting
Li, Wangwang
Lei, Cheng
Li, Yongwei
Li, Zhiqiang
Xiong, Jijun
Text and Data Mining valid from 2021-10-02
Version of Record valid from 2021-10-02
Article History
Received: 27 January 2021
Revised: 2 July 2021
First Online: 2 October 2021