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Effect of copper incorporation into silver nanoparticles on the structural, morphological, and rheological properties of lead-free pastes for solar cell applications

Crossref DOI link: https://doi.org/10.1007/s13367-026-00154-8

Published Online: 2026-03-13

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Abdessalam, Hazmoune

Azeddine, Lounis

Chetoui, Abdelmounaim https://orcid.org/0000-0003-1542-7691
Belkhettab, Ilyas

Bencherifa, Ismail

Kellai, Ahmed
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Text and Data Mining valid from 2026-03-13

Version of Record valid from 2026-03-13
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Article History

Received: 2 November 2025

Revised: 2 February 2026

Accepted: 22 February 2026

First Online: 13 March 2026

Declarations

:

: The authors declare that there are no conflicts of interest.

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