Cooling Computer Chips with Cascaded and Non-cascaded Thermoelectric Devices
Crossref DOI link: https://doi.org/10.1007/s13369-019-03862-2
Published Online: 2019-06-20
Published Print: 2019-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Al-Shehri, Saleh A. http://orcid.org/0000-0002-6835-4820
Funding for this research was provided by:
Royal Commission for Jubail and Yanbu (IFR-381-4)
Text and Data Mining valid from 2019-06-20
Version of Record valid from 2019-06-20
Article History
Received: 17 December 2018
Accepted: 17 April 2019
First Online: 20 June 2019