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Thermal Dependency Assessment of Silicon Wafer Behaviour Oriented at Different Angles

Crossref DOI link: https://doi.org/10.1007/s13369-021-06239-6

Published Online: 2021-10-07

Published Print: 2022-07

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Mrad, Hatem https://orcid.org/0000-0001-8808-7507
Elsharkawi, Ehab

Abdelaziz, Mohamed

Farid, Hicham
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Text and Data Mining valid from 2021-10-07

Version of Record valid from 2021-10-07
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Article History

Received: 20 October 2020

Accepted: 20 September 2021

First Online: 7 October 2021