Numerical Investigation on Thermal Performance of PCM-Based Hybrid Microchannel Heat Sinks for Electronics Cooling Application
Crossref DOI link: https://doi.org/10.1007/s13369-022-07007-w
Published Online: 2022-06-17
Published Print: 2023-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ramesh, K. Naga
Sharma, T. Karthikeya
Rao, G. Amba Prasad
Murthy, K. Madhu
Text and Data Mining valid from 2022-06-17
Version of Record valid from 2022-06-17
Article History
Received: 10 January 2022
Accepted: 18 May 2022
First Online: 17 June 2022
Declarations
:
: The authors declare that they have no conflict of interest.