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Thermal stability, adhesion and electrical studies on (Ti,Zr)N x thin films as low resistive diffusion barriers between Cu and Si

Crossref DOI link: https://doi.org/10.1007/s13391-013-3145-8

Published Online: 2014-05-10

Published Print: 2014-05

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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