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Peel strength of sputtered FCCL(Flexible Copper Clad Laminate) using Ar:O2 mixed gas preprocessing and a Ni-Cr seed layer

Crossref DOI link: https://doi.org/10.1007/s13391-013-3316-7

Published Online: 2014-07-10

Published Print: 2014-07

Update policy: https://doi.org/10.1007/springer_crossmark_policy