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Effects of solvent on the formation of the MUA monolayer on Si and its diffusion barrier properties for Cu metallization

Crossref DOI link: https://doi.org/10.1007/s13391-013-3339-0

Published Online: 2014-05-10

Published Print: 2014-05

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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