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Microstructures and fatigue life of SnAgCu solder joints bearing Nano-Al particles in QFP devices

Crossref DOI link: https://doi.org/10.1007/s13391-014-3190-y

Published Online: 2014-05-10

Published Print: 2014-05

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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