Document is current

Any future updates will be listed below

Effect of aluminium additions on wettability and intermetallic compound (IMC) growth of lead free Sn (2 wt. % Ag, 5 wt. % Bi) soldered joints

Crossref DOI link: https://doi.org/10.1007/s13391-014-3364-7

Published Online: 2014-09-10

Published Print: 2014-09

Update policy: https://doi.org/10.1007/springer_crossmark_policy

About CrossMark