Large area photonic flash soldering of thin chips on flex foils for flexible electronic systems: In situ temperature measurements and thermal modelling
Crossref DOI link: https://doi.org/10.1007/s13391-014-4222-3
Published Online: 2014-11-10
Published Print: 2014-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
van den Ende, D. A.
Hendriks, R.
Cauchois, R.
Groen, W. A.
Text and Data Mining valid from 2014-11-01