Depletion and phase transformation of a submicron Ni(P) film in the early stage of soldering reaction between Sn-Ag-Cu and Au/Pd(P)/Ni(P)/Cu
Crossref DOI link: https://doi.org/10.1007/s13391-014-4224-1
Published Online: 2015-01-10
Published Print: 2015-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ho, Cheng-En
Hsieh, Wan-Zhen
Yang, Tsung-Hsun
Text and Data Mining valid from 2015-01-01