Reliability of an ultra-fine-pitch COF flip-chip package using non-conductive paste
Crossref DOI link: https://doi.org/10.1007/s13391-015-2235-1
Published Online: 2016-01-07
Published Print: 2016-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kim, Hae-Yeon
Min, Kyung-Eun
Lee, Jun-Sik
Lee, So-Jeong
Lee, Sung-Soo
Kim, Jun-Ki
Text and Data Mining valid from 2016-01-01