Ball shear strength and fracture modes of lead-free solder joints prepared using nickel nanoparticle doped flux
Crossref DOI link: https://doi.org/10.1007/s13391-015-4377-6
Published Online: 2015-05-10
Published Print: 2015-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Sujan, G. K.
Haseeb, A. S. M. A.
Amalina, M. A.
Nishikawa, Hiroshi
Text and Data Mining valid from 2015-05-01