Formation of solid-solution Cu-to-Cu joints using Ga solder and Pt under bump metallurgy for three-dimensional integrated circuits
Crossref DOI link: https://doi.org/10.1007/s13391-015-5015-z
Published Online: 2015-06-30
Published Print: 2015-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lin, Shih-kang
Chang, Hao-miao
Cho, Cheng-liang
Liu, Yu-chen
Kuo, Yi-kai
Text and Data Mining valid from 2015-06-30