Sn-Ag-Cu to Cu joint current aging test and evolution of resistance and microstructure
Crossref DOI link: https://doi.org/10.1007/s13391-015-5201-z
Published Online: 2015-10-28
Published Print: 2015-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Xu, Di Erick
Chow, Jasper
Mayer, Michael
Jung, Jae Pil
Yoon, Jong Hyun
Text and Data Mining valid from 2015-10-28